Application Areas
Precision consumables and core components for key industries
Nozzle aperture precise as 0.025mm ± 0.001mm, surface finish Ra0.2
3C Electronics
Our high-precision dispensing nozzles and automation parts serve 3C electronics manufacturing, providing reliable core component support from precision dispensing to automated assembly.
- SMT Assembly & Precision Dispensing Nozzles
- BGA & Flip Chip Underfill Dispensing Nozzles
- Display Lamination & Sealing Dispensing Nozzles
- PCB Protective Coating Dispensing Nozzles
Semiconductor Packaging
From die attach to wire bonding, our die bonding tools and dispensing nozzles enable precise semiconductor packaging processes.
- Die Attach & Underfill Dispensing Nozzles
- Die Bonding Tools & Wire Bonding
- Dam & Fill Dispensing Nozzles for Encapsulation
- Wafer-Level Packaging Dispensing Nozzle Solutions
Automation
Providing precision parts and supporting components for automation equipment and production lines.
- Supporting Parts for Automation Equipment
- Automation Precision Dispensing Nozzles
- Precision Components for Automated Inspection Equipment
- Parts for Automated Handling & Conveying Systems
Die Bonding
Our high-quality die bonding tools provide the precision and reliability required for die attach and wire bonding processes.
- Precision Die Bonding Tools
- Ultrasonic Wedge Bonding Tools
- Thermosonic Gold Ball Bonding Tools
- Custom Bonding Tool Design
