March 2025
Precision Dispensing Nozzle Product Line Upgrade
Introducing a new generation of high-precision dispensing nozzles tailored for more demanding microelectronic packaging processes.
Tailored Solutions For Your Needs!
Founded in 2009, YeTrue is dedicated to becoming a specialist in high-precision core components. We focus on dispensing nozzles, chip bonding tools, and automation parts, with particular expertise in micro-hole machining—nozzle apertures can be machined to 0.025 mm ± 0.001 mm with a surface finish of Ra0.2. We provide stable, reliable consumable solutions to global customers.
Precision Dispensing
High-precision dispensing systems compatible with VERMES, MUSASHI, and NORDSON standards, suitable for 3C and semiconductor packaging.
Bonding Tools
High-precision dispensing nozzles for SMT, BGA, and Flip Chip underfill processes in semiconductor packaging and electronics assembly, available in various specifications and materials to ensure dispensing consistency and reliability.
Automation Solutions
Custom automation equipment for 3C assembly, leadframe processing, and semiconductor manufacturing.
Our Services
High-Precision Dispensing Nozzles
Precision dispensing nozzles for semiconductor packaging and electronics assembly, offering multiple specifications and materials for consistent, reliable dispensing.
Chip Bonding Tools
Specialized tools for chip placement and bonding processes, manufactured with precision to meet demanding packaging requirements.
Automation Parts & Custom Support
Precision parts for automation equipment plus custom design and technical support tailored to customer requirements.
Application Areas
Serving key industries with precision consumables and core components
3C Electronics Manufacturing
Dispensing nozzles and automation components for precision dispensing and assembly in smartphones, tablets, and wearable devices.
Semiconductor Packaging
Die attach, wire bonding, eutectic, and thermocompression processes supported by high-precision bonding tools and nozzles.
Automation Equipment
Precision parts and custom components for automated production lines, supporting assembly, inspection, and palletizing applications.
Advantages
Precision Manufacturing Experience
Years of specialized R&D and manufacturing expertise in high-precision dispensing nozzles, chip bonding tools, and automation parts.
Customization Capability
Custom products available for non-standard sizes, special materials, and specific structures based on customer process requirements.
End-to-End In-House Production
Core design, machining, and inspection processes are handled in-house to ensure stable quality and delivery.
Strict Quality Control
High-precision inspection equipment is used to verify each batch for consistent performance and reliability.
Durability and Cost Performance
Products are manufactured with high-quality materials and advanced processes for long service life and strong value.
Professional Technical Support
Comprehensive technical services from product selection and application debugging to process optimization.
Industries
Automotive
Electronics
Medical
Aerospace
Mechanical Engineering
Lubrication Industry
News
February 2025
Chip Bonding Tools Receive Customer Certification
The new chip bonding tools passed validation with multiple semiconductor packaging customers and delivered excellent performance.
January 2025
Automation Parts Production Capacity Expanded
Production lines for automation parts were expanded to meet growing demand and improve delivery capabilities.
Have Questions?
We would be happy to assist you. Please feel free to call, email, or fill out the contact form.